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What is a medical scribe? This article covers what the roles and duties of a scribe are, basics of why medical scribing is effectively changing healthcare, and who might be interested in becoming a hospital scribe. Medical scribing was introduced in the mid-1990s, but it is still considered a relatively new idea and many people are not familiar with the concept. Scribes work for providers at hospitals, outpatient clinics, and medical offices to improve physician productivity and healthcare efficiency. This allows doctors to spend more time face-to-face with patients and provide personalized care without getting caught up in charts. Figure shows 100 μm SiC scribed at 300 mm/sec.A medical scribe is someone who is trained to document physician-patient encounters quickly and accurately so that doctors do not have to. Scribing techniques include trench-ablation, and also a proprietary internal material scribe that results in low debris and very easy die breaking and separation. The use of silicon carbide is rapidly increasing for high voltage and high-power components, including Wide Band Gap (WBG) semiconductors. Lasers: picosecond lasers, green ns pulsed lasers, UV ns pulsed lasers UV laser scribing speed for similar wafers are up to 6 minutes as compared to 2 hours with saw and diamond cutting tools. Pictured is GaP scribing at 300 mm/s for a 30 μm deep cut, which is deep enough to break wafers up to about 250 µm thick. The throughput of one laser scribing system can replace and exceed the capacity of multiple traditional die separation tools combined. This example shows sapphire scribing for LED device singulation, kerf width 2.5 µm. The line beam enables greater utilization of available laser power with reduced heating affect, leading to high scribing throughput. Sapphire scribing is performed on wafers used in LED manufacture using proprietary line-beam technology. The narrow kerf allows tighter die packing density and higher wafer yield.
#Groove scribe do manual
IPG’s systems typically used in laser scribing can be configured for manual load, or with fully automated part handling and machine vision for highest throughput and unattended operation. IPG scribing systems offer high-precision production proven processes that optimize results and offer users the flexibility to adjust process parameters in response to specific application needs. Narrower and cleaner cuts achieved using UV lasers provide a better die count per wafer as well as higher yields, due to fewer damaged die than with conventional saw scribing methods. LED wafers are expensive, so wafer real estate is valuable.
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Scribing has application in many semiconductor technologies, and is particularly used in the LED and III-V industries which are characterized by relatively small wafers having narrow die-separation streets. In this respect, scribing is different to dicing, where the wafer is fully cut through in a single process step. Scribing is the term used within the semiconductor industry to describe the die singulation technique whereby the wafer or substrate is only partially cut through by one process tool, and then divided into individual die by a subsequent ”breaking” step that separates the wafer along the scribed lines. Laser Scribing | Sapphire, Silicon Carbide & Wafer Scribing